The Sniper III is the latest in BGA and Micro BGA Rework system design. With On-Board control and powerful computer profile generation, including data logging. The system also includes a Thermalcouple Bank to develop the rework profile and monitor the component, board and environment. A 17″ monitor reflects the image of the bottom of the chip and the footprint on the board, these images are then adjusted to exactly overlay each other and the component placed automatically. APE will be performing the installation and training on June 23, 2010.
